Sr. Director, Chiplets/FCBGA Integration

Amkor is currently seeking a Sr. Director, Chiplets/FCBGA for our Tempe, AZ office. The primary function of this position is to lead the strategy, development, and execution of advanced chiplet-based module technologies, including HDFO (High Density Fan-Out) and other advanced IC package solutions for AI, computing, networking, and PC client markets. This individual will serve as a key interface with Tier 1 customers and Amkor’s leading-edge R&D center in South Korea, driving technology roadmaps, customer engagement, and successful commercialization of next-generation packaging solutions., * Lead advanced IC package development initiatives with customers and Amkor’s development teams in Korea, aligning technical solutions with customer and market requirements.

• Drive strategic engagement with Tier 1 customers, including technology roadmap discussions, development reviews, and executive-level communications.
• Champion innovation in package architectures, materials, thermal management, warpage control, and heterogeneous integration technologies.
• Lead cross-functional teams involving package design, materials characterization, simulation, reliability, and process development resources.
• Guide product development from concept through qualification, technology transfer, and production ramp.
• Identify technical and business opportunities to expand Amkor’s position in advanced packaging solutions for AI, high-performance computing, and networking applications.
• Monitor industry trends and emerging technologies to influence product strategy and development priorities.
• Manage program objectives, schedules, risks, and customer expectations to achieve successful business outcomes.

• This position requires a Bachelor’s degree in Engineering (Mechanical Engineering or Materials Science and/or graduate studies in these disciplines are highly preferred). Master’s degree preferred.
• 12+ years of experience in semiconductor packaging development is required.
• Demonstrated experience leading advanced packaging or product development programs within a global organization.
• Strong understanding of IC package design environments and the trade-offs associated with package design for FCBGA and heterogeneous module-based package development.
• Working knowledge of mechanical stress/strain and IC package warpage derived from packaging materials and mechanical configurations.
• Familiarity with Co-Packaged Optics, current trends, and performance drivers.
• Experience influencing technical roadmaps and driving alignment between customer requirements and internal development priorities.
• Previous product or program management experience involving offshore development teams is highly desired.
• Deep knowledge of IC packaging materials, failure modes, and reliability qualification procedures.
• Excellent written, verbal, and customer-facing communication skills.
• Ability to work effectively across global organizations and cultures.
• This position requires 20% domestic and 20% international travel., * Demonstrated experience developing package technology roadmaps for AI accelerators, high-performance computing, and data center applications.
• Expertise in Fan-Out IC Packaging, including low-density (LDFO), high-density (HDFO), and bridge-based heterogeneous products.
• Expertise in large-body FCBGA packaging, including warpage control, stress management, underfill, and TIM materials.
• Working knowledge of semi-additive plating chemistries and equipment.
• Familiarity with Design of Experiments (DOE) and Statistical Process Control (SPC).