Technical Solution Director

We are seeking a highly motivated Technical Solution Director/Senior Director to lead and contribute to one or multiple Manufacturing EDA SW solution domains, including Computational Lithography, Computational Metrology & Inspection, and Process Digital Twin software solutions. The focus will be on the technical solution development and deployments with our Tier 1 customers in both logic and memory manufacturers. Reporting directly to the Vice President of Siemens EDA Calibre Manufacturing Portfolio Unit, this role will be a key member of the senior management team within the Calibre Manufacturing Portfolio Unit.

Role and Responsibilities

• Develop deep market and technology insights across the Manufacturing EDA landscape, identifying both vertical and cross-domain opportunities spanning RET/OPC, metrology & inspection, yield optimization, and manufacturing physics simulation.
• Partner with regional sales and application leaders to drive strategic customer engagements and secure key design and manufacturing wins with leading semiconductor manufacturers.
• Co-define and execute the long-term n+2 semiconductor process technology roadmap through close collaboration with tier-1 customers and leading research institutions.
• Maintain comprehensive awareness of competitive dynamics, ecosystem players, and emerging trends within the Manufacturing EDA market across Foundry, Memory, and IDM segments.
• Collaborate closely with R&D teams to architect, develop, and deploy state-of-the-art computational lithography solutions for advanced DUV and EUV technologies, addressing complex technical and business challenges.
• Lead cross-functional teams-including Product Engineers (PEs) and Application Engineers (AEs)-to deliver benchmark achievements, accelerate solution deployment, and efficiently resolve technical issues.

• Master's or Ph.D. degree in Computer Science, Electrical Engineering, Physics, or a related technical discipline.
• 15+ years of industry experience in Computational Lithography, with deep expertise developed at leading EDA companies and/or semiconductor technology development organizations.
• 10+ years of hands-on experience in Computational Lithography, advanced mask, or TCAD physics simulation areas.
• Proven leadership experience (5+ years) managing and scaling cross-functional teams across R&D, Product Engineering, and Applications Engineering within global, matrixed organizations.
• Deep understanding of semiconductor manufacturing processes, with direct collaboration experience with leading IC manufacturers at advanced technology nodes.
• Strong knowledge of the foundry ecosystem or advanced memory manufacturing business and demonstrated experience supporting yield ramp and technology enablement for leading-edge process nodes.
• Demonstrated ability to operate effectively in fast-paced, globally distributed environments, influencing stakeholders across organizational and geographic boundaries.
• Proven track record of driving customer engagement and successfully introducing and deploying new technologies, methodologies, and system-level solutions.
• History of delivering complex, high-impact programs with strong execution discipline and predictable outcomes.
• Willingness and ability to travel domestically and internationally as required.
• Excellent verbal and written communication skills in English, with the ability to communicate effectively across technical, business, and executive audiences.

Siemens EDA is a global technology leader in Electronic Design Automation software. Our software tools enable companies around the world to develop highly innovative electronic products faster and more cost-effectively. Our customers use our tools to push the boundaries of technology and physics to deliver better products in the increasingly complex world of chip, board, and system design.