Principal IC Test Development Engineer

NXP
United States
2 months ago
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Role details

Contract type
Permanent contract
Employment type
Full-time (> 32 hours)
Experience level
Expert
Experience required
5 years minimum
Working hours
Regular working hours
Job source

Tech stack

Software Debugging Logic Synthesis of Circuits

Job description

Developing complete industrial test plans for high performance mixed-signal integrated circuits on industry standard Automated Test Equipment (ATE) Designing custom circuitry on ATE interface boards for testing high-precision, high-speed products, particularly in regard to layout matching & symmetry, impedance control, and component selection with attention to bandwidth, noise, linearity, and repeatability Working with cross-functional engineers at product concept to properly define characterization/validation setups and product manufacturability Help define Design for Testability (DfT) features/circuits from design concept stage to manufacturability Working in a cross functional team environment with Analog & Digital Design, System Definer, Product Engineering, Quality Engineering, and Applications Engineering to deliver products on schedule on budget Job includes all administrative aspects of Test Engineering – customer support, data evaluation, report generation, defining test limits, and mass production support

Requirements

BSEE or higher (MSEE preferred) and a minimum of 5 years of test development experience on ATE with high performance integrated circuits

Innovation in test techniques

Advantest 93K (SmarTest8 preferred) and/or Teradyne UltraFllex tester experience, or capability and willingness to learn these ATE platforms

Thorough understanding of digital, analog, and mixed-signal device testing, PVT characterization, IC qualification, product launch, and customer RMA support

Experience with statistical data processing, designs of experiment, test debug and problem solving methodologies, to drive best possible test time & test cost reduction, and yield enhancement

Working knowledge of, and some experience with IC foundries and offshore assembly & test subcons (OSATs)

Familiarity of IC fabrication processes and its effect on test performance

Skill required in reliability, failure analysis, and circuit debug processes

Ability to work collaboratively with a diverse, global product development team from product concept to high volume production

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