Director - Package Materials Integration, APTD

As Director of Package Materials Integration in Advanced Packaging Technology Development (APTD), you will lead the strategy, execution, and interpersonal capability for Micron’s advanced packaging materials roadmap for advanced 3D memory products including HBM and 3DS DRAM! You will lead a distributed team with direct reports in both the U.S. and Asia and work closely multi-functional partners across process development, process integration, equipment development, manufacturing, global quality, and purchasing! You will be responsible for setting the advanced packaging materials roadmap, driving supplier engagement to meet roadmap needs, building interpersonal capability across regions, leading materials aspects of program execution, and resolving critical materials-package interaction issues.

Responsibilities will include, but are not limited to:

• Lead the advanced packaging materials roadmap and ensure alignment with overall product roadmap timelines across multiple development programs.

• Provide interpersonal leadership for a diverse materials portfolio that includes chemistries (plating, cleaning, etc.), photoresists, films (dicing tapes, temporary bond films, etc.), polymer composites (NCF, mold compound, etc.), and carrier materials (glass, silicon, etc.).

• Lead supplier engagement at executive and engineering levels to prototype, develop, and certify materials in alignment with program requirements, timelines, and long-range roadmap needs.

• Build and lead a high-performing distributed team with direct reports in both the U.S. and Asia, establishing clear priorities, talent development plans, and strong execution rigors.

• Partner with process engineering, equipment development, and process integration leaders to ensure all TD work are met and that regional teams operate with aligned priorities and decision-making.

• Drive materials characterization strategies to understand materials-package interaction mechanisms using analytical, mechanical, and thermal testing and analysis, and translate findings into development and product decisions.

• Using AI to improve processes

Successful candidates for this position will have

• Shown success leading technical organizations with a good foundation in structured problem solving.

• Experience and working knowledge with 2.5D/3D heterogeneous integration technologies such as WLFO, SoIC, CoWoS, WoW, InFO, and other chiplet/SiP architectures.

• Experience and working knowledge with materials used throughout the advanced packaging flow.

• Understanding of and experience working with materials suppliers in the advanced packaging supply chain/ecosystem.

• Working knowledge of materials characterization techniques and simulation (thermal/mechanical/electrical) methodologies.

• Knowledge in materials-package interactions.

• Experience with wafer bumping, package assembly, substrate technology, BOM selection, testing and product development lifecycle.

• Excellent communication skills with the ability to convey complex technical concepts to both technical and non-technical collaborators.

Required Experience:

• Master of Science/PhD in chemistry, chemical engineering, or materials science and engineering. PhD preferred.

• 15+ years of relevant experience in semiconductor manufacturing or a related field, including hands-on experience in semiconductor advanced packaging.

• 10+ years of management/leadership experience in packaging technology development, including responsibility for leading global teams and driving execution across regions.

• Strong understanding of semiconductor process integration and process development.

Micron Technology, Inc. (Boise, ID)

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