Senior Package Layout Engineer - Hardware

NVIDIA Ltd.
Santa Clara, CA, United States
29 days ago
Apply on www.indeed.com
Prepare application

Role details

Contract type
Permanent contract
Employment type
Full-time (> 32 hours)
Experience level
Expert
Experience required
5 years minimum
Compensation
$136,000.0 - $258,750.0
Working hours
Regular working hours
Job source

Tech stack

Cadence Virtuoso Signal Integrity Pcb Layout

Requirements

  • Hold a B.S. Electrical Engineering or equivalent experience
  • 5+ years experience in PCB Layout of graphics cards, motherboards, line cards or other related technology. Experience with HDI designs is a plus
  • Proven experience in substrate layout of wire bond and flip chip packages, preferred
  • Significant background with Cadence APD or SiP and/or PCB layout tools (including Constraint Manager)
  • Solid understanding of high-speed design signal integrity practices
  • Experience with Virtuoso and Calibre is a plus
  • Experience using Valor is helpful

Benefits & conditions

NVIDIA’s GPUs and SOCs are the world leaders in power, performance and efficiency. We are continually innovating to deliver new and creative, unusual solutions to extraordinary problems in a wide range of sectors. To this purpose, we are now seeking a hard-working Senior Package Layout Engineer who is committed to making a difference in the world through their contributions!

This position will collaborate with Technical Package Lead and different design teams in the design and development of sophisticated, detailed layout of IC substrates for NVIDIA products. In addition, work with design teams to plan schedules, resolve costs, manufacturing, and electrical design issues.

What you’ll be doing:

  • As part of a Layout team, you will collaborate to implement high speed/density ASIC packages.
  • Perform substrate breakout patterns for ASIC packages.
  • Optimize package pinout incorporating system level trade-offs of pins assignment.
  • Help perform package routing, placement, stack-up, reference plane and power distribution using Cadence APD or SiP tool suite.
  • Propose layout design trade-offs to the Technical Package Lead for resolution and implementation.
  • Conduct design feasibility studies to evaluate the Package design goals for size, cost, and system performance.
  • Develop symbols and CAD library databases using Cadence APD design tools
  • Develop methodologies to improve layout productivity, Your base salary will be determined based on your location, experience, and the pay of employees in similar positions. The base salary range is 136,000 USD - 212,750 USD for Level 3, and 168,000 USD - 258,750 USD for Level 4.

About the company

NVIDIA is widely considered to be one of the technology world’s most desirable employers! We have some of the most forward-thinking and dedicated people in the world working for us. If you’re creative and autonomous, we want to hear from you.

Apply for this position

This job is hosted externally. Click below to view the full posting and apply.

Apply on www.indeed.com
Prepare application

Good distractions

Talks and stories from around this role — technically off-topic, practically not.

1:16 min

Training against media augmentations to preserve signal integrity

Haoqi Wu Haoqi Wu · World Congress 2026 Europe

3:30 min

Transitioning from CUDA software architect to user

Stephen Jones · Coffee With Developers

4:17 min

Integrating signals with libraries and NgRx

Daniela Bonvini · LIVE

1:34 min

Profiling and debugging GPU code with Nsight developer tools

Paul Graham Paul Graham · World Congress 2025

5:12 min

Testing simulated foldable layouts and anticipating multi-fold hardware

Matthew Atkinson Matthew Atkinson

2:02 min

Integrating cost signals into pull requests and code

Christian Grieger Christian Grieger · Europe 2026 Virtual

Videos

See all

Related articles

See all