MTS Hardware Development Eng.

Job Duties: Support engineering team by loading, testing, and validating thermal solutions for rack mount servers. Recommend design changes and optimize configurations. Systematic use simulation early in the design process to prevent failure modes in products and assist in problem resolution. Troubleshoot thermal and airflow issues in new and existing product lines. Work with the engineering team to optimize thermal performance of servers using empirical data and bench test methods. Optimize airflow speed, volume, and flow paths to meet customer and components requirements. Support custom engineering projects that require hands-on ability to interconnect complex server systems. Use analytical tools to determine root cause and design changes required to remedy premature failures. Produce thermal reports from experimental data and test/modeling benchmarks. Create manufacturing feasible new product concepts by applying engineering principles and analytical techniques. Development

of CFD and thermal simulation methods and the integration into existing/emerging engineering development processes. Utilize knowledge of mechanics, heat transfer, and computational fluid dynamics, as well as knowledge of design techniques, tools, and principles. Apply knowledge of engineering principles, best practices, and technologies to the design, development, and testing of various company proprietary products.

Requirements: Master’s degree or foreign equivalent in Mechanical Engineering, Computer Engineering, or related field and three (3) years of experience in job offered or in a closely related engineering role.

Employer will alternatively accept a Bachelor’s degree or foreign equivalent in Mechanical Engineering, Computer Engineering, or related field and five (5) years of progressive post-baccalaureate experience in job offered or in a closely related engineering role.

Position requires three (3) years of experience in the following:

• Complete thermal design and validation cycle of HPC, AI, and storage servers;

• Conducting system-level thermal simulations to evaluate chassis airflow distribution to identify thermal bottlenecks and optimize component thermal performance;

• Defining and executing thermal test plans;

• Designing and developing custom heat sinks and cold plates;

• Selecting thermal interface materials (TIMs) to meet cooling demands of high-power CPUs and GPUs; and

• Validation of heat sink and fan designs.

At AMD, your base pay is one part of your total rewards package. Your base pay will depend on where your skills, qualifications, experience, and location fit into the hiring range for the position. You may be eligible for incentives based upon your role such as either an annual bonus or sales incentive. Many AMD employees have the opportunity to own shares of AMD stock, as well as a discount when purchasing AMD stock if voluntarily participating in AMD’s Employee Stock Purchase Plan. You’ll also be eligible for competitive benefits described in more detail. For more information visit https://careers.amd.com/benefits.