WeAreIn for jobs that impact everyone’s life. Join the thinkers, builders, and problem-solvers behind tomorrow’s technology. As a Staff Engineer Simulation and Package Design Methodology on our Research & Development team, you’ll have the opportunity to merge creativity with your technical expertise by shaping the future of technology, driving groundbreaking projects, and bringing new ideas to life. Are you in? Your RoleKey responsibilities in your new roleDevelop and support simulation methodologies, design flows, and tool environments for Chip-Package-Board (CPB) Co-Design and advanced package development in Linux-based HPC environmentDrive and continuously improve methodologies for electromagnetic, thermal and multiphysics analysis supporting semiconductor package and system developmentOwn and maintain the simulation environment within the CPB Co-Design Flow & Methodology team and provide consulting and support to product development projects worldwideEnable simulation-driven design

and verification for advanced packaging technologies including System-in-Package (SiP), heterogeneous integration, and 2.5D/3D package solutionsCollaborate closely with Business Lines, Design Systems, package development teams, and external technology partners to address simulation requirements and develop best-in-class engineering solutionsDrive technology evaluations, benchmarks, automation initiatives, and knowledge sharing activities to continuously improve simulation capabilities and engineering productivityYour ProfileQualifications and skills to help you succeedDegree in Electrical Engineering, Microelectronics, Physics, Computational Engineering, Mechanical Engineering, or a related technical discipline At least 4 years of professional experience in semiconductor package development, simulation, design methodologies, EDA environments, or related engineering fieldsStrong background in electromagnetic, thermal or multiphysics simulation for semiconductor package and system developmentHands-on experience with industry-standard simulation environments such as Synopsys/Ansys, Cadence, Siemens, Keysight, COMSOL, or comparable engineering platformsProven track record in developing, optimizing, and deploying simulation methodologies, engineering workflows, and design environmentsSolid knowledge of Linux and one or several of the following programming languages: Python, bash, MATLAB, Perl, skillStrong analytical and problem-solving skills combined with excellent communication abilities and a customer-oriented mindsetExperience with development and integration of Machine Learning (ML) and Artificial Intelligence (AI) tools for design or simulation is an advantageFluent English skills are required; German language skills are considered as an

advantageThe employment is in accordance with the collective salary and wage agreement for employees of the electrical and electronics industry, employment group G (https://www.feei.at/aktuelles/mindestloehne-und-gehaelter-eei/). The monthly salary is paid 14 times p.a. We offer a higher compensation depending on your expertise and skills. Contact: Maria Pollai-Schlintl, LinkedIn#WeAreIn for driving decarbonization and digitalization.

As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.

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