Senior Staff Engineer Module Package Development

• Develop and define package concepts for AI power-supply products, with an emphasis on high-performance computing (HPC) modules.
• Validate proposed package concepts through simulation and hardware demonstrators, working closely with Back-End development, product development, and system architects.
• Coordinate and align new package ideas with Back-End development teams (internal and OSAT partners) and launch required assembly projects.
• Track and support package development projects through to final product release.
• Identify emerging development needs and translate them into additions/updates to the package roadmap.
• Serve as the technical point of contact for customer questions related to packaging.
• Stay current on packaging solutions by continuously monitoring market trends and conducting competitor benchmarking.
• Spot and assess business opportunities created by new technologies and packaging concepts.
• Lead the technical definition for major/new package projects (e.g., BOM, package design, assembly technology selection, PRP reviews, project classification), including risk and impact assessment.
• Define package characteristics that satisfy electrical, thermal, mechanical, and reliability requirements.
• Act as a key interface to partners and technical consultants on package definition, particularly for Back-End assembly technology expertise.
• Support pre-development and project definition activities and remain the packaging design expert throughout the full project lifecycle.

• Bachelor’s degree in Engineering (e.g., Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, or Applied Physics) with ~7+ years of relevant experience in assembly technologies.
• Strong hands-on knowledge of Back-End processes, materials, and interdependencies (including laminate design, materials, and manufacturing processes).
• Working knowledge of SMT and PCB/module-related technologies.
• Expertise in semiconductor packaging, assembly, and test.
• Working knowledge on flip/chip process, package/strip grinding, molding
• Experience with failure analysis and reliability engineering.
• Strong analytical, statistical ( JMP, Minitab), and structured problem-solving skills.
• AutoCAD and 3D drafting skills preferred.
• Excellent communication and presentation skills, must be able to communicate effectively English ( Mandarin is a plus), both verbally and in writing.

As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener. Are you in?

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