Advanced Package Integration Engineer - Server Products

We are looking for an experienced Advanced Package Integration Engineer to drive package process development and product NPI for AMD’s EPYC server products. You will own product package planning, development, and qualification activities across internal cross-functional teams and external suppliers. The role requires leading global teams to design test vehicles and product packages, develop and qualify processes, and resolve technical and schedule challenges to meet product milestones. You will regularly report progress to program managers and senior leadership, and work with ecosystem partners to collect and analyze data and implement effective solutions.

This position offers the chance to work across multiple disciplines and geographies, influence product strategy, and solve high-impact technical challenges., * Define test-vehicle and product-package designs and create execution plans with cross-functional teams.

• Lead technology development and product NPI, coordinating milestones across geographies and suppliers.
• Identify technical and schedule risks; develop and implement mitigation plans.
• Troubleshoot and resolve issues affecting schedule, yield, reliability, and process robustness.
• Collect, analyze, and present data to drive technical decisions and continuous improvement.
• Communicate technical status, recommendations, and risks clearly to program managers and senior leadership.
• Collaborate with material/equipment suppliers, OSATs, foundries, and other ecosystem partners to enable product success., AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.

The ideal candidate will have strong project management, problem-solving,written and verbal communication skills with the ability to present complex technical information to diverse audiences., * Hands-on experience with advanced 3D and 2.5D package structures, wafer-level assembly, substrate assembly, RDL, bumping, composite materials, and polymers.

• Experience working directly with OSATs, material/equipment suppliers, and foundry partners.
• Experience leading global project teams and managing NPI schedules and qualifications.
• Proven experience in semiconductor packaging development, especially for advanced server products.
• Demonstrated leadership driving cross-functional projects with internal teams and external suppliers
• Yield improvement, reliability, and process development.

Education:

BS/MS/PhD in Mechanical Engineering, Material Science, Electrical Engineering, Chemical Engineering or equivalent

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