Senior Semiconductor Test Engineer

We are seeking an experienced Test Engineer to design, develop, and deploy test programs for our Multi-Chip Module (MCM) and System-in-Package (SiP) products. We also need someone to architect and setup a test environment.

The ideal candidate can take a component datasheet and independently translate its electrical, functional, and timing requirements into a working test program.

As our senior test engineer, you’ll define how every product is validated before it reaches our customers.

You’ll work closely with design engineering, quality, manufacturing, and supply chain to develop qualification strategies, analyze performance data, and ensure every replacement device meets electrical, thermal, mechanical, and reliability requirements.

This is a highly visible role where you’ll help establish the testing processes and standards that support the future growth of the company.

Key Responsibilities

· Datasheet-to-Test-Program Development: Analyze semiconductor part datasheets (digital, analog, mixed-signal, RF, or power devices) and translate electrical specifications, timing diagrams, and functional requirements into comprehensive test plans and executable test programs.

· Test System Architecture: Help design, build, and maintain an in-house PXI type (National Instruments or equivalent) modular bench test system - selecting chassis, modules (DMM, scope, DIO, power supplies, switching), and instrumentation to cover the electrical test needs of our product lines.

· Test Program Design: Develop, debug, and validate test programs/software (e.g., LabVIEW, TestStand, Python with instrument drivers) for functional, parametric, and characterization testing at the board/module level.

· Boundary Scan & JTAG Test: Develop and execute boundary scan (JTAG/IEEE 1149.1) test strategies for interconnect verification, programming, and structural test of assembled boards and modules.

· MCM/SiP Test Strategy: Design test methodologies appropriate for multi-component modules, including interconnect/bond verification, thermal considerations, and system-level functional test of integrated packages. Contribute to future KGD test strategy discussions.

· Test Fixture & Interface Development: Define and collaborate on test fixtures, interface boards, and cabling/connector solutions needed to interface the test system with the unit under test.

· Correlation & Characterization: Perform bench-to-bench and unit-to-unit correlation, guard banding, and basic statistical analysis to ensure test coverage and repeatability.

· Cross-Functional Collaboration: Partner with design engineering, package engineering, product engineering, and quality teams to resolve test escapes, board-level failures, and design-for-test (DFT) concerns.

· Documentation: Create and maintain test specifications, test flow documentation, and test result/data logs.

· Production Support: Support new product introduction (NPI), test program qualification, and ongoing test process improvement.

Debug & Failure Analysis: Investigate test failures, working with design and failure analysis (FA) resources to root-cause issues at the component, interconnect, or module level.

We are a company committed to creating diverse and inclusive environments where people can bring their full, authentic selves to work every day. We are an equal opportunity/affirmative action employer that believes everyone matters. Qualified candidates will receive consideration for employment regardless of their race, color, ethnicity, religion, sex (including pregnancy), sexual orientation, gender identity and expression, marital status, national origin, ancestry, genetic factors, age, disability, protected veteran status, military or uniformed service member status, or any other status or characteristic protected by applicable laws, regulations, and ordinances. If you need assistance and/or a reasonable accommodation due to a disability during the application or recruiting process, please send a request to HR@insightglobal.com.To learn more about how we collect, keep, and process your private information, please review Insight Global’s Workforce Privacy Policy: https://insightglobal.com/workforce-privacy-policy/.

· Bachelor’s degree in Electrical Engineering, Computer Engineering, or related field (or equivalent practical experience).

· Must be able to obtain a US security clearance.

· 7+ years of hands-on semiconductor, board-level or module-level test engineering experience.

· Demonstrated ability to read and interpret semiconductor datasheets and convert specifications into test plans and test programs without heavy hand-holding.

· Hands-on experience with boundary scan / JTAG (IEEE 1149.1) test development and tools (e.g., Corelis, ASSET InterTech, JTAG Technologies, XJTAG, or similar).

· Experience building or programming test systems on a modular instrumentation platform such as PXI/PXIe (National Instruments or equivalent), VXI, or LXI-based bench setups.

· Proficiency with LabVIEW, TestStand, and/or Python or other scripting language (with instrument drivers such as VISA/SCPI) for test automation.

· Solid understanding of analog, digital, and/or mixed-signal test techniques (DC parametric, functional, AC timing, and/or RF as applicable to your product mix).

· Comfort working with general-purpose lab instrumentation (DMMs, oscilloscopes, power supplies, function generators, switch matrices) and designing test fixtures/interfaces around them.

Strong problem-solving skills and comfort working independently to build test capability from the ground up in a fast-paced NPI environment. · Experience standing up a test system from scratch - selecting PXI/PXIe chassis and modules, building a mixed instrumentation rack, and developing the software architecture to drive it.

· Familiarity with known-good-die (KGD) methodologies and multi-die test strategies - a plus for future roadmap needs, not required today.

· Experience with semiconductor package-level JESD47 “Qualification Testing” thermal, mechanical, or reliability tests (e.g., burn-in, temp cycling, THB, ESD, etc…).

· Familiarity with die-to-die or component interconnect technologies (wire bond, flip chip, SMT) and how they affect test approach.

· Familiarity with PCB manufacturing process and test (Flying probe, AOI, X-ray, etc..).

· Experience with design-for-test (DFT) collaboration during early product development, including boundary scan chain design input.

· Experience with version control, test data management, and basic database/reporting tools for test result tracking.

· Six Sigma, quality systems, or reliability engineering exposure.

· Failure analysis experience (X-RAY, CSAM, cross-sectioning, curve tracing, etc…)

Knowledge of ATE platforms (Teradyne, Advantest, or equivalent).