Integration Engineer - BCD Technology

You’ll thrive in this role if you enjoy working at the intersection of technology development and manufacturing readiness, are comfortable navigating trade-offs across integrated device and process modules, and take ownership of driving complex technical issues to closure in an advanced manufacturing environment.

• Responsibilities

This role sits at the critical intersection between technology development and manufacturing readiness. The work you do directly determines whether new BCD platforms successfully transition from promising concepts into reliable, scalable technologies that enable next-generation products across power, automotive, industrial, and imaging markets. Strong execution in this role accelerates time-to-market, reduces downstream risk, and sets the foundation for success at onsemi’s most advanced fab.

Representative Projects May Include

• Driving high-voltage BCD platform enhancements from development through qualification and manufacturing readiness.
• Integrating embedded non-volatile memory modules into an established BCD technology.
• Enabling ROIC-optimized process flows and advanced capacitor (MIM) options, including integration and manufacturability trade-offs within a complex BEOL stack.
• Developing low-power and low-noise CMOS options to improve performance in sensitive analog and imaging applications.
• Improving DMOS performance and reliability through targeted device and process integration changes, with emphasis on qualification and manufacturability.
• Supporting packaging and post-fab readiness using standardized test vehicles to accelerate technology qualification.

• Education: BS or higher degree in Engineering or Materials Science
• Experience: 2-4 years or more of relevant experience in semiconductor manufacturing integration and technology development.
• Familiar with 5S, 8D, 6-sigma, SPC, DOE, FMEA
• Demonstrated experience with back-end-of-line (BEOL) process integration, including areas such as MIM capacitors, copper metallization, CMP, dielectric integration, or related BEOL modules.
• Familiarity with post-fab process considerations (e.g., probe, backgrind, backside metallization, or packaging interfaces) as they relate to technology qualification and manufacturability.
• Strong technical judgment and ability to drive complex, cross-module integration decisions with limited precedent.
• Experience working in or alongside advanced 300 mm semiconductor manufacturing environments.

Salary: onsemi is excited to share the base salary range for this position is $127,800 to $217,000 exclusive of fringe benefits or potential bonuses. The final pay rate for the successful candidate will depend on geographic location, skills, education, experience, and/or consideration of internal equity of our current team members. We also offer a competitive benefits package. https://www.onsemi.com/site/pdf/Benefits-Summary-USA.pdf

onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.

More details about our company benefits can be found here: https://www.onsemi.com/careers/career-benefits About the Team We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work.