Junior Engineer for Process Integration of embedded non-volatile memory stack applications
Role details
Job location
Tech stack
Job description
GlobalFoundries Fab 1 in Dresden, Germany, is seeking a new graduate to join the team responsible for integrating embedded non-volatile memories in advanced 300mm semiconductor manufacturing. The role centers on STT-MRAM technology, with a focus on performance monitoring, cost efficiency, yield improvement, and process stability. Collaboration with process engineering and integration platform teams is essential, utilizing standardized GlobalFoundries business processes such as ICAR, 8D, MRB, ECM, and PCRB. The team supports both new product introduction and high-volume production, as well as the development of emerging technologies through experimental design and technical analysis. Candidates should demonstrate a strong grasp of semiconductor principles and a balanced approach to technology development, considering quality, cost, and delivery., * Develop, optimize, and stabilize process integration of an embedded STT-MRAM in the 22nm FDSOI node.
- Characterize inline MTJ stack parameters and implement advanced inline monitoring techniques for process control.
- Sustain and improve manufacturing technologies by enhancing product quality, reducing defects, and increasing efficiency.
- Collaborate with Fab1 teams, including unit process, yield engineering, analysis labs, and quality and reliability groups, to address MRAM-related performance and reliability issues.
- Support new product introduction, characterization, and production ramp-up in alignment with the Fab1 manufacturing roadmap.
- Support the design and analysis of experiments for MRAM stack development and integration.
- Contribute to improving yield, reliability, and overall manufacturability across technology platforms.
- Collaborate closely with integration teams and customer partners to ensure alignment on technical goals.
- Assist in handling process deviations and participate in structured problem-solving using the 8D approach.
Requirements
- M.Sc., Dipl. Ing, or PhD in Electrical Engineering, Materials Science, Physics, or a related technical field.
- Basic knowledge of magnetic non-volatile semiconductor memories and CMOS process integration; expertise in solid-state physics and magnetic thin films is advantageous.
- Experience in semiconductor technology, process integration, or unit process modules is preferred.
- Strong analytical and problem-solving skills.
- Ability to work independently and in diverse, multicultural environments.
- Excellent communication and interpersonal skills.
- Prior exposure to multicultural environments is a plus.
- Fluency in English (written and verbal, at least C1 level); proficiency in German is an advantage.
Benefits & conditions
The position is open-ended and to be filled as soon as possible.
Attractive compensation components:
13th month salary, bonus payments, assistance with relocation to Dresden.
Flexible working time arrangements:
Family friendly part-time models, trust flextime, salary conversion into free time