Staff Design Engineer, HBM

Micron Technology, Inc.
Richardson, TX, United States
20 days ago

Role details

Contract type
Permanent contract
Employment type
Full-time (> 32 hours)
Experience level
Expert
Experience required
6 years minimum
Working hours
Regular working hours
Job source

Tech stack

Computer Programming Computer Engineering Software Debugging Dynamic Random-Access Memory Formal Verification Python (Programming Language) Scripting Yield Optimization

Job description

HBM product family is growing due to high demand from industry-leading semiconductor companies. As an HBM Memory Design Engineer - Sustaining (Staff) , you will work closely with cross-functional teams including Design Engineering (DE), Product Engineering (PE), Process Integration, Packaging, and Technology Development (TD) to analyze and resolve silicon issues across HBM products .

You will collaborate with architecture to understand new or updated specification requirements and contribute to the implementation, verification, and maintenance of design updates , supporting both silicon release and ongoing product lifecycle needs. This role requires strong technical execution and the ability to independently drive complex issues to closure., * Design Support: Work on HBM product design and support sustaining design maintenance (ECOs/spec changes).

  • Silicon Debug: Own end-to-end debug of silicon, system, and customer issues, driving root-cause analysis and resolution.
  • Cross-Functional Collaboration: Work closely with DE, PE, TD, and system teams to execute issue resolution and ensure alignment on priorities.
  • Quality & Yield Improvement: Identify and debug yield, reliability, and performance issues to improve product quality.
  • Customer Support: Support customer bring-up, qualification, and system-level debug activities as needed.
  • Continuous Improvement: Contribute sustaining learnings to improve design quality, debug efficiency, and verification methodologies.

Requirements

  • 6+ years (BS) or 4+ years (MS) in Electrical Engineering, Computer Engineering, or related field
  • Strong understanding of DRAM/HBM architecture and high-speed memory interfaces
  • Experience in digital and/or custom design and verification
  • Hands-on experience in silicon debug or post-silicon validation
  • Ability to independently drive complex technical issues to closure, * Experience with HBM/DDR/LPDDR or high-speed IO systems
  • Background in system-level debug and silicon-to-system correlation
  • Knowledge of timing and margin analysis, signal and power integrity
  • Experience with DFT / mBIST / test-mode debug
  • Programming/scripting skills (Python preferred) for debug automation
  • Strong communication skills with ability to work across cross-functional teams

About the company

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Micron’s Heterogeneous Integration Group (HIG) is shaping the future of AI and accelerated computing by developing advanced memory solutions! The team focuses on designing and optimizing High Bandwidth Memory (HBM) products for AI/ML, high-performance computing (HPC), and data-centric systems, collaborating across global engineering and product teams to deliver industry-leading performance, power efficiency, and reliability!, Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

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