Director, Chiplets/FCBGA Integration

Amkor is currently seeking a Director, Chiplets and FCBGA for our Tempe, AZ office. The primary function of this position is program management for development of advanced chiplet-based IC Packages including HDFO (High Density Fan-out) and other advanced IC Package constructions for Computing, Networking and Mobile market spaces. This person will be the primary interface with Tier 1 customers and Amkor’s leading edge R&D center in South Korea., * Drive and coordinate development activities with customers, in conjunction with Amkor’s R&D development teams in Korea.

• Lead Tier 1 customer interface meetings, discussions and follow-up actions during the project development phase.
• Manage a cross-functional team with all Amkor resources as required to execute the project in a timely manner, including R&D, Design, Characterization and Simulation teams.
• Manage customer product management through the development phase and into initial production ramp.

• Bachelor’s Degree in Engineering, with Mechanical Engineering or Materials Science preferred. A Master’s degree is a plus.
• 10+ years of experience in semiconductor package development is required, with direct experience in IC Packaging.
• The qualified candidate understands the IC package design environment, and tradeoffs associated with package design during process development of FCBGA packages.
• A working knowledge of mechanical stress/strain and IC package warpage is required.
• Deep knowledge of IC packaging materials, failure modes and reliability qualification procedures is required.
• Excellent written and verbal communication skills are needed.
• This position requires 10-20% travel including domestic and international travel., * Expertise in high-density fan-out (HDFO) or bridge-like chiplet module constructions, constraints and tradeoffs.
• Mechanical or Thermal simulation experience.
• Familiarity with Design of Experiments and Statistical Process Control.

Amkor Technology, Inc. (Nasdaq: AMKR) is the world’s largest U.S. headquartered OSAT and is a global leader in outsourced semiconductor packaging and test services. With a strong track record of innovation, a broad and diverse geographic footprint and solid partnerships with lead customers, Amkor delivers high-quality solutions that enable the world’s leading semiconductor and electronics companies to bring advanced technologies to market. The company’s comprehensive portfolio includes advanced packaging, wafer-level processing, and system-in-package solutions targeting applications for smartphones, data centers, artificial intelligence, automobiles and wearables. For more information visit amkor.com.